Spotted by GforGames site, in a GeekBench test results and running inside an unknown smartphone, MediaTek’s MT6795 managed to score 886 points in the single-core test and 4536 points in the multi-core test. These results were enough to put it neck to neck with the mighty Qualcomm Snapdragon 810 SoC tested in the LG G Flex 2, which scored 1144 points in the single-core and 4345 in the multi-core test. While it did outrun the MT6795 in the single-core test, the multi-core test was clearly not kind on the Snapdragon 810.
The unknown device was running on Android Lollipop OS and packed 3GB of RAM, which might gave the MT6795 an edge over the LG G Flex 2.
MediaTek’s octa-core MT6795 was announced last year and while we are yet to see some of the first design wins, recent rumors suggested that it could be powering Meizu’s MX5, HTC’s Desire A55 and some other high-end smartphones. The MediaTek MT6795 is a 64-bit octa-core SoC clocked at up to 2.2GHz, with four Cortex-A57 cores and four Cortex-A53 cores. It packs PowerVR G6200 graphics, supports LPDDR3 memory and can handle 2K displays at up to 120Hz.
As we are just a few days from Mobile World Congress (MWC) 2015 which will kick off in Barcelona on March 2nd, we are quite sure that we will see more info as well as more benchmarks as a single benchmark running on an unknown smartphone might not be the best representation of performance, it does show that MediaTek certainly has a good chip and can compete with Qualcomm and Samsung.
According to Toms Hardware one of the unexpected features of DirectX 12 is the ability to use Nvidia GPUs alongside AMD GPUs in multi-card configurations.
This is because DirectX 12 operates at a lower level than previous versions of the API it is able to treat all available video resources as one unit. Card model and brand makes no difference to a machine running DX12.
This could mean that the days of PC gamers having to decide between AMD or Nvidia could be over and they can pick their referred hardware from both companies and enjoy the best of both worlds. They will also be able to mix old and new cards.
However there might be a few problems with all this. Rather than worrying about your hardware optimization software developers will have to be on the ball to make sure their products work.
More hardware options means more potential configurations that games need to run on, and that could cause headaches for smaller studios.
It would appear that the world is rushing to Nvidia to buy its latest GPU at the expense of AMD.
According to the data, NVIDIA and AMD each took dramatic swings from Q4 of 2013 to Q4 of 2014 with Nvidia increasing its market share over AMD by 20 per cent and AMD’s market share has dropped from 35 per cent at the end of 2013 to just 24 per cent at the end of 2014.
Meanwhile, Nvidia has gonr from 64.9 per cent at the end of 2013 to 76 per cent at the end of 2014.
The report JPR’s AIB Report looks at computer add-in graphics boards, which carry discrete graphics for desktop PCs, workstations, servers, and other devices such as scientific instruments.
In all cases, AIBs represent the higher end of the graphics industry using discrete chips and private high-speed memory, as compared to the integrated GPUs in CPUs that share slower system memory.
On a year-to-year basis, total AIB shipments during the quarter fell by 17.52 per cent , which is more than desktop PCs, which fell by 0.72 percent .
However, in spite of the overall decline, somewhat due to tablets and embedded graphics, the PC gaming momentum continues to build and is the bright spot in the AIB market.
The overall PC desktop market increased quarter-to-quarter including double-attach-the adding of a second (or third) AIB to a system with integrated processor graphics-and to a lesser extent, dual AIBs in performance desktop machines using either AMD’s Crossfire or Nvidia’s SLI technology.
The attach rate of AIBs to desktop PCs declined from a high of 63 per cent in Q1 2008 to 36 per cent this quarter.
So in other words It is also clear that the Radeon R9 285 release didn’t have the impact AMD had hoped and NVIDIA’s Maxwell GPUs, the GeForce GTX 750 Ti, GTX 970 and GTX 980 have impacted the market even more than expected.
This is ironic because the GTX 970 has been getting a lot of negative press with the memory issue and AMD makes some good gear, has better pricing and a team of PR and marketing folks that are talented and aggressive.
Intel’s exascale computing efforts have received a boost with the extension of the company’s research collaboration with the Barcelona Supercomputing Center.
Begun in 2011 and now extended to September 2017, the Intel-BSC work is currently looking at scalability issues with parallel applications.
Karl Solchenbach, Intel’s director, Innovation Pathfinding Architecture Group in Europe said it was important to improve scalability of threaded applications on many core nodes through the OmpSs programming model.
The collaboration has developed a methodology to measure these effects separately. “An automatic tool not only provides a detailed analysis of performance inhibitors, but also it allows a projection to a higher number of nodes,” says Solchenbach.
BSC has been making HPC tools and given Intel an instrumentation package (Extrae), a performance data browser (Paraver), and a simulator (Dimemas) to play with.
Charlie Wuischpard, VP & GM High Performance Computing at Intel said that the Barcelona work is pretty big scale for Chipzilla.
“A major part of what we’re proposing going forward is work on many core architecture. Our roadmap is to continue to add more and more cores all the time.”
“Our Knights Landing product that is coming out will have 60 or more cores running at a slightly slower clock speed but give you vastly better performance,” he said.
Intel’s transition from 22nm to 14nm, with out-of-order architecture better known as Atom, was not a walk in the park.
Intel had to delay its next generation Atom out-of-order architecture codenamed Braswell all the way to Q3 2015 and, at that time, we expect to see the Braswell-based Pentium N3700 replacing the Bay-Trail-M BGA based N3540. Last time we mentioned Braswell, the processor was delayed to Q2 2015 and now it slipped an additional quarter.
The Pentium N3700 is 14nm quad core clocked at 1.6GHz, with the ability to jump all the way to 2.4GHz. The Bay Trail-M based Pentium N3540 is clocked at 2.16GHz base clock and 2.66GHz Turbo.
As you can see, Braswell 14nm has a significantly lower clock and Turbo at a 6W TDP (Thermal Design Power) and 4W Scenario Design Power (SDP). Pentium N3640 Bay Trail has a 7.5W TDP and 3.5W SPD, so the TDP went significantly down but the SDP went up, just barely.
The Intel HD Graphics core also works at 400MHz base and 700MHz maximum frequency on the Braswell Pentium N3700, which is slower than the N3540 with its 313MHz base and 896MHz Turbo clock.
The Pentium N3700 supports DDR3L 1600 MHz memory, has 2MB cache and it comes in BGA packaging. The good news is that the new platform supports Chrome, Linux, Windows 7 64-bit only as well as Windows 8.1 and Windows 10 64-bit only.
There will be a few other Braswell 14nm dual- and quad-core processors that will end up branded as Celerons. The Atom brand name is gone in the notebook / Chromebook market.
Sony is expected to use more MediaTek application processors in upcoming Xperia smartphones.
According to Digitimes, the Japanese consumer electronics giant is planning to increase its reliance on MediaTek chips in entry-level and mid-range smartphones this year. There is still no word on high-end products, and it seems Qualcomm’s 800-series parts will continue to power Xperia flagships for the time being.
Sony is also working with a number of Taiwanese ODMs like Foxconn, FIH Mobile, Compal and Arima Communications. The company’s latest Xperia E4 smartphone was in fact outsourced to Arima.
As for Foxconn/FIH Mobile and Compal, they are said to be developing 4G models for Sony, which means they are supposed to cover the mid-range segment. Most of this new models are expected to be based on MediaTek’s new octa-core MT6752 processor, which packs 64-bit Cortex-A53 cores.
The affordable MT6752 has already found its way into a number of Chinese mid-range smartphones, as well big-brand devices like the HTC Desire 826 and Acer Liquid Jade S.
Intel is planning to continue making unlocked superclocked X-series processors that we all know as Haswell-E or Sandy Bridge-E.
The next one in line to replace the current Haswell-E series is called Broadwell-E, and this is an eight-core 140W processor. The information comes from Intel’s own roadmap and we don’t have too many details yet.
Just like the Core i7 5960X, Core i7 5930K and Core-i7 5820K, there will be one unlocked eight-core Broadwell-E X version of Broadwell-E and two six-core K versions. They will all share the same 140W TDP. We know that it is too early to talk about official branding, but Core i7 6960X sounds about right.
Broadwell E will use the LGA 2011-v3 socket and the current X99 PCH chipset. We guess that there will be a bios update and that the new Broadwell-E parts should work on existing X99 motherboards that you can already buy today. The platform relies on DDR4 memory, just like Haswell-E. We expect it will start with the $999 eight-core flagship (X version) and go down to about $400 for the slowest six-core part.
If you are in market for one, start saving right now, as Broadwell-E should launch roughly a year from now.
Intel has delayed shipment of a component module required for its silicon photonics technology, because they are not meeting quality specifications.
The original batch of modules, which was supposed to ship at the beginning of the year, will now be used as samples for testing.
Now it looks like silicon photonics cables for connecting servers won’t be installed before 2016.
The delay will hurt customers who are counting on silicon photonics for specific applications in the near term, although more widespread adoption was still a few years away anyway.
Servers that support silicon photonics will have special MXC connectors in which fibre optic cables are plugged. One MXC connection, which combines multiple silicon modules, could eventually transfer data at up to 1.6Tbps (terabytes per second), or 800Gbps in each direction.
Silicon photonics has been researched for more than a decade and Intel wants to make sure the modules work well before launch.
Nvidia’s G-Sync technology, which synchronizes frame refresh times with the refresh rate of a compatible monitor, it comes at a price, though, because G-Sync only works with monitors have special hardware.
However world on the street is that the mobile incarnation, will work on ordinary laptops.
PC Perspective investigated an Nvidia driver leak and discovered it enables G-Sync on the ASUS G751, an excellent laptop released late last year without a G-Sync display module.
The site found that the ASUS G751 is in fact capable of refresh rates as high as 100Hz, which makes the 1080p panel quicker than some desktop G-Sync desktop monitors. There was no prototype or hidden G-Sync module was stuffed inside the ASUS notebook which means that hardware was not required.
There are still a few problems. A flicker that commonly appears with G-Sync monitors at low frame rates was encountered with the G751, and the laptop also suffered occasional “dropouts” which caused the display to go entirely blank.
Nvidia says the driver was provided to OEMs “to begin the process of validating and troubleshooting” the beast.
AMD’s first 14nm processors are codenamed Summit Ridge and they are reportedly based on an all-new architecture dubbed Zen.
Information on the new architecture and the Summit Ridge design is still very sketchy. According to Sweclockers, the chips will feature up to eight CPU cores, support for DDR4 memory and TDPs of up to 95W.
Summit Ridge will use a new socket, designated FM3. This suggests we are looking at A-series APUs, but there is no word on graphics and the eight-core design points to proper FX-series CPUs – we simply do not know at this point. It is also possible that Summit Ridge is a Vishera FX replacement, but on an FM socket rather than an AM socket.
Of course, AMD Zen should end up in more products than one, namely in APUs and Opteron server parts. The new architecture has been described as a “high-performance” design and will be manufactured using the Samsung-GlobalFoundries 14nm node.
As for the launch date, don’t hold your breath – the new parts are expected to show up in the third quarter of 2016, roughly 18 months from now.
AMD released its earnings today and one cool question came up about the upcoming Carrizo mobile APU.
Lisa SU, the new AMD President and CEO, told MKM Partners analyst Ian Ing that Carrizo is coming in Q2 2015.
This is a great news and AMD’s Senior VP and outgoing general manager of computing and graphics group John Byrne already shared a few details about his excitement about Carrizo.
There are two Carrizo parts, one for big notebooks and All in Ones called Carrizo and a scaled down version called Carrizo L. We expect that the slower Carrizo-L is first to come but, Lisa was not specific. Carrizo-L is based on Puma+ CPU cores with AMD Radeon R-Series GCN graphics is intended for mainstream configurations with Carrizo targeting the higher performance notebooks.
Usually when a company says that something is coming in Q2 2015 that points to a Computex launch and this Taipei based tradeshow starts on June 2 2015. We strongly believe that the first Carrizo products will showcased at or around this date.
Lisa also pointed out that AMD has “significantly improved performance in battery life in Carrizo.” This is definitely good news, as this was one of the main issues with AMD APUs in the notebook space.
Lisa also said that AMD expects Carrizo to be beneficial for embedded and other businesses as well. If only it could have come a bit earlier, so let’s hope AMD can get enough significant design wins with Carrizo. AMD has a lot of work to do in order to get its products faster to market, to catch up with Intel on power and performance or simply to come up with innovative devices that will define its future. This is what we think Lisa is there for but in chip design, it simply takes time.
AMD has developed facial recognition technology to enable users to organize and search video clips based on the people featured in them.
AMD executive Richard Gayle demonstrated to Tom’s Guide how AMD Content Manager, uses facial recognition to browse through a group of local videos to find specific faces.
There is an index that displays the people’s faces that have been detected throughout the video clips.
The user can edit the names of the people as well as add keyword tags to help improve future searches for specific people.
For instance, if you are searching for videos that feature one person, you can click on his or her respective face to pull up the corresponding videos.
Additionally, if you want to narrow a search to a specific person combined with a keyword tag, you can drag the face icon and click on the desired keyword.
Once you click on the video you wish to view, a player appears in the right windowpane, along with a timeline displayed at the bottom with a list of all the people who appear in the video.
The timeline is separated into various coloured boxes to mark the exact moment in the video when each person first appears on screen, so you do not have to watch the entire video to see the bit you want.
The application also has facial recognition capabilities that allow users to do some basic editing, such as compiling a single montage video of any individual or individuals.
While this is pretty good technology, it probably does not have any major use yet on its own.
Gayle said it is unlikely that AMD will release Content Manager in its current form but will license it to OEMs that are able to rebrand the application before offering it on their respective systems.
He claimed that only AMD processors have sufficient power to operate the application, because of the processor’s ability to have the CPU, GPU and memory controller work closely together.
New evidence coming from two LinkedIn profiles of AMD employees suggest that AMD’s upcoming Radeon R9 380X graphics card which is expected to be based on the Fiji GPU will actually use High-Bandwidth Memory.
Spotted by a member of 3D Center forums, the two LinkedIn profiles mention both the R9 380X by name as well as describe it as the world’s firts 300W 2.5D discrete GPU SoC using stacked die High-Bandwidth Memory and silicon interposer. While the source of the leak is quite strange, these are more reliable than just rumors.
The first in line is the profile of Ilana Shternshain, an ASIC Physical Design Engineer, which has been behind the Playstation 4 SoC, Radeon R9 290X and R9 380X, which is described as the “largest in ‘King of the hill’ line of products.”
The second LinkedIn profile is the one from AMD’s System Architect Manager, Linglan Zhang, which was involved in developing “the world’s first 300W 2.5D discrete GPU SOC using stacked die High Bandwidth Memory and silicon interposer.”
Earlier rumors suggest that AMD might launch the new graphics cards early this year as the company is under heavy pressure from Nvidia’s recently released, as well as the upcoming, Maxwell-based graphics cards.
We want to make sure that you realize that 20nm GPUs won’t be coming at all. Despite the fact that Nvidia, Qualcomm, Samsung and Apple are doing 20nm SoCs, there won’t be any 20nm GPUs.
From what we know AMD and Nvidia won’t be releasing 20nm GPUs ever, as the yields are so bad that it would not make any sense to manufacture them. It is not economically viable to replace 28nm production with 20nm.
This means the real next big thing technology will be coming with 16nm / 14nm FinFET from TSMC and GlobalFoundries / Samsung respectively, but we know that AMD is working on Caribbean Islands and Fiji as well, while Nvidia has been working on its new chip too.
This doesn’t mean that you cannot pull a small miracle in 28nm, as Nvidia did that back in September 2014 with Maxwell and proved that you can make a big difference with optimization on the same manufacturing process, in case when the new node is not an option.
Despite the lack of 20nm chips we still think that next gen Nvidia and AMD chips bring some innovations and make you want to upgrade in order to buy it to play the latest games on FreeSync or G-Sync monitors, or in 4K/UHD resolutions.
In addition to the 14nm Broadwell-U notebook chips announced earlier, Intel has also announced that it has started shipping 14nm Cherry Trail Atom architecture tablet chips to customers.
While it is good to hear that Intel has finally started to ship the successor to the Bay Trail SoC, these chips will most likely be available in actual products sometime in Q2 2015, or according to Intel, in the first half of the year. While Intel did not shed any light on the actual specifications of Cherry Trail SoCs, or the price, it did promise that all details will be unveiled once first Cherry Trail-based devices are announced, so we will keep our fingers crossed to see some first tablets at CES 2015.
For now, Intel only noted that the new architecture will bring improved graphics, improved performance as well as better battery life in both Android and Windows tablets. From earlier information we know that, beside being based on smaller 14nm node, Cherry Trail SoC will use the Airmont CPU architecture paired up with a cut-down Broadwell GPU and might even end up with 16 EUs, which should give it some impressive graphics performance.
Intel also noted that Cherry Trail can be paired with Intel XMM726x modem with Cat 6 LTE for cellular connectivity, which means that we might even see some smartphones based on these SoCs. It will also support Intel’s RealSense technology as well as Wireless Display.