Intel’s restructuring axe seems to be falling on its PC client division and software areas with more than 12000 jobs to go.
Our well-placed sources are confident that the PC group will be the hardest hit. This is all because the PC market has stopped growing and Intel has to find its way to new markets to supplement loss of this business.
Latest research data from IDC indicates that in 2016 PC market will decline from 275.8 million units in 2015 to 260.8 million units in 2016 and the current projections for 2017 show the PC market slightly decreasing to 257.9 million units. At its peak PC market was at 364.0 million units, but this was in 2011 when things were rosier, kids were polite to their parents, and rock stars played decent music. These times are clearly behind us and Intel knows it.
The PC group downsize is being supervised by Dr. Venkata “Murthy” Renduchintala who is Intel’s number two. He is the bloke who was paid $25 million dollars to defect from Qualcomm. Murthy has already done a high level clean up at PC client group and is believed to be thinking about dusting the top of the corporate bookshelf next.
Another team which will be pummeled is Rene James’s old software outfit. People from software services and the security division formerly known as McAfee are expected to mostly go the same way as the artist formerly known as Prince.
Murthy’s also wants to get Intel to the right course with IoT market. Marketing for that area is expected to grow from $655.8 billion in 2014 to $1.7 trillion in 2020. Intel wants the piece of that cake, and perhaps a few tea and biscuits to go with it and it will be interesting to look the fight in this promising land market.
There is still no killer app to help the IoT market which defines it. IoT right now is nothing and everything.
A recent Chinese-language Economic Daily News report claims that Mediatek wants the spun off business to drive VR sales. It all sounds pretty good but MediaTek have sort of denied the rerport.
Well we say sort of denied it. What it has told the Taiwan Stock Exchange that it was not the report’s source, which is not quite the same thing.The spin off could go ahead, but MediaTek is denying that it told the EDN its cunning plans. But then again the EDN did not name its source either. Without a denial from the company we are none the wiser.
MediaTek’s VR unit was set up between end-2015 and early-2016 to focus on the development of the company’s VR solutions for handsets, the EDN thought.
Nvidia has been talking about its Tesla M10 GPU designed to run on the latest version of the company’s GRID technology.
For those who came in late, GRID technology is supposed to give servers a kick in the graphics back-end. It powers virtual desktops and support cloud-powered gaming.
Nvidia says the Tesla M10 GPU can support up to 64 desktops per board and 128 per server with two boards. This means shedloads of virtual machines which are potentially dead and alive.
The new graphics card ccan support Citrix’s XenApp and virtual PCs running Windows, or power virtual workstations that need the performance for professional graphics work.
The M10 is a bit like the M6 and M60 as a GPU accelerator – unlike the M10 motorway which is a disappointingly short road connected the M1 to the A414 just south of St Albans.
Companies making use of virtual machines or looking to substitute hardware for more efficient virtual systems can access the GRID and Tesla tech for less than $2 per month per user for use with virtual apps and remote desktop sessions, and the firm will provide virtual PCs for less than $6 per month per user.
Figures from Mercury Research show that AMD appears to be clawing back some market share.
Of course market share does not mean profits, but it is the sort of news that AMD needs. Particularly, it does not appear that AMD is doing that much.
Mercury Research’s latest GPU market report, show that in the first quarter overall graphics unit volumes declined by 10.2 per cent in comparison to last year. However AMD gained discrete GPU market share.
This surge was on the back of AMD’s Radeon R9 Series GPUs as well as AMD’s revitalised driver development strategy. It clawed back 1.8 share points in desktop discrete graphics (that is 22.7 per cent) and 7.3 share point jump in notebook discrete, moving to 38.7 per cent share. Better than a poke in the eye with a short stick and could provide a bit of momentum when AMD’s next generation Polaris Architecture-based 14nm discrete graphics products are released this quarter.
The findings confirm what Wells Fargo analyst David Wong said earlier this week. He added that AMD has modeled for sequential growth, but Nvidia has guided for a 10 per cent sequential decline in sales for the quarter ended April 2016.
This suggests that what Nvidia has lost has been gained by AMD. If AMD manages to build momentum, it could pose a serious threat to Nvidia and expose the green goblin’s lack of GPU variety in the mid-tier. In order to retain its market share, Nvidia needs to come up with tactics to re-establish its dominance via product differentiation and feature incorporation.
The move will open up new opportunities for designers of autonomous vehicles and security systems, among other connected things, according to ARM CEO Simon Segars. Computer vision is in its early stages, and Apical is at the forefront of embedding such technology, he said.
Apical’s technologies is already used in 1.5 billion smartphones, according to ARM, although many of those phones may be using nothing more sophisticated than a display brightness control Apical calls Assertive Display. That technology also turned up in Samsung Electronics’ new laptop, the ATIV Book 9.
Assertive Camera is another of Apical’s developments: It’s a range of software packages and silicon-based image signal processors for reducing image noise, managing color and shooting high dynamic range images.
ARM makes its money by designing chips that others manufacture, or licensing its chip modules for others to incorporate in their own designs.
In that context, Apical’s Spirit silicon building blocks are perhaps where ARM sees the most opportunity for growth. The Spirit silicon blocks process raw sensor data or video into a machine-readable representation of an image in an energy-efficient way, so ARM and its partners can use them to add computer vision capabilities to future low-power devices.
Putting image analysis and interpretation capabilities in hardware could accelerate and simplify the design of a whole host of products, including self-driving cars and security systems.
ARM paid US$350 million for Apical, closing the deal Tuesday, it said.
Nvidia forecast better-than-expected revenue for the current quarter demand for its chips has risen, while its rival, AMD has a knap while waiting for its Zen technology to arrive.
Shares of the company, which also reported profit and revenue above analysts’ estimates, were up 7.5 percent in extended trading.
The chipmaker last week unveiled its GeForce GTX 1080 and 1070 graphics processors based on its Pascal technology.
Chief Executive Jen-Hsun Huang said the new Pascal GPU architecture will give a giant boost to deep learning, gaming and VR. The processors were in full production and would be available later this month.
Revenue from its gaming business, which designs graphics cards such as GeForce for PCs, rose 17 percent to $687 million.
The company has weathered a shrinking personal computer industry by focusing on game enthusiasts, who are willing to pay hundreds of dollars for processors used in playing graphically demanding games. Revenue from its data center business, which includes its Tesla processors, rose 62.5 percent to $143 million.
The company said it expected second-quarter revenue to be $1.35 billion. Analysts were expecting $1.28 billion for the quarter. Nvidia’s net income rose to $196 million in the first quarter ended May 1 from $134 million a year earlier. Revenue rose 13.4 percent to $1.31 billion, while analysts were expecting $1.26 billion.
The company also said it intends to return about $1 billion to shareholders in fiscal 2017 through quarterly dividends and share buybacks.
According to a fresh rumor report, AMD could announced its first Polaris GPU architecture based graphics cards at a dedicated event in China, in late May.
While earlier reports suggested that Computex 2016 show might be the place that AMD picked for launch of its graphics cards based on 14nm Polaris GPU architecture, a fresh report coming from Zolkorn site claims that the press announcement, or a paper-launch, might actually happen at a dedicated event in China.
According to the source, AMD has already sent out invites to a select members of the press for an event that will take place in Macau, China. It is believed that AMD will officially present first Radeon R9 400 series graphics cards based on Ellesmere and Baffin GPUs at this event.
As this will probably be a paper-launch, the official launch could still be scheduled for Computex 2016 show when AMD AIB partners will have those same graphics cards ready.
The same report also suggests that the new Radeon R9 400 series graphics card should be available shortly after Computex 2016 show, which will allow Nvidia to somewhat counter Nvidia’s recent GTX 1080/1070 launch, although we are pretty sure that these will not target the same market segment.
In May 2015, we reported that AMD’s first Zen CPUs, launching in Q4 2016, would most likely be quad-core chips based on a presentation slide showing the company’s Zen core units scaling up to four cores with shared L3 cache. According to new information released one year later, this may not be the case and, the company could be preparing to launch eight and six-core variants in a tight efficiency race against Intel’s ‘Kaby Lake’ CPUs.
AMD’s official “Zen-based Quad Core Unit” slide” was released May 6, 2015 during its Financial Analyst Day when the company claimed its new platform will have a more competitively-focused IPC design, higher core counts, lower latency caches and will be based on second-generation 14nm Low-Power Plus (LPP) process technology.
On Wednesday, sources close to the folks at Italian site Bitsandchips.it now suggest that AMD will produce 8-core and 6-core Zen x86 chips initially – and only in the event of bad yields will OEMs and ODMs decide to use quad-core variants. Due to the fact that Intel is launching 6-core and 10-core high-end Broadwell-E processors later this month, it appears AMD will be initially focused on bringing back some high-end desktop (HEDT) market share from Intel’s stagnant performance numbers.
In recent benchmarks, the Core i7 6950X is only about 10 percent faster than the Core i7 5960X in Cinebench multi-threaded performance, while the former Haswell-E chip is actually slightly faster in Cinebench single-threaded tests. This is a great place for AMD to gain some ground against Intel’s ‘Kaby Lake’ CPUs in Instructions Per Clock (IPC) by launching Zen with a higher number of cores, at least initially.
We mentioned in August 2015 that Zen uses SMT (hyperthreading) just like Intel’s cores and will be switching back to a single FPU-per core design. With this market approach, every core will be able to run two simultaneous threads just like Intel’s CPUs. This is AMD’s way of breaking from the “core pair” implementation that was established in Bulldozer in October 2011, also known as Clustered Multithreading (CMT).
Of course, AMD will eventually release a 16-core x86 Zen APU with Greenland integrated graphics, but this is not expected to compete with Intel until 2017 when 10-nanometer Cannonlake CPUs are released later in the year. AMD can also produce an 8-core and even 6-core version of this Zen APU
Bristol Ridge APUs will initially take dual-core and quad-core designs
Meanwhile, the company is planning to announce some new dual-core and quad-core APUs later this month at Computex 2016, codenamed Bristol Ridge, to compete with current Intel 6th-generation Skylake CPUs. These 7th-generation APUs are built using four ‘Bulldozer’ CPU cores and eight GPU cores, and AMD will categorize them as “entry level” CPUs when they launch later this summer. Already, HP has announced an Envy x360 15-inch convertible with dual-core and quad-core Bristol Ridge parts based on the AMD FX naming scheme.
GlobalFoundries has been ramping up production of its second-generation 14-nanometer technology, also known as 14 Low-Power Plus (14LPP) since Q4 2014 and provided some validation on production samples in December 2015. AMD has said in the past that it will not pay GlobalFoundries (or any foundry) to develop custom silicon for its architectural designs. With this in mind, the company is relying heavily on the success of the GF second-gen 14LPP process technology and fully-depleted silicon technology to restore its core PC business back to levels it has not experienced in years. The improvements should help AMD gain traction in both TDP efficiency and performance that will allow the company to effectively scale Zen designs across more market segments in years to come.
Apple’s partner in crime, TSMC has begun to tape out the design for Apple’s A11 processor built on a 10nm FinFET process.
Digitimes’ deep throats claimed TSMC is expected to achieve certification on its 10nm process in the fourth quarter of 2016, and deliver product samples to the customer for validation in the first quarter of 2017.
This means that TSMC could begin small-volume production for Apple’s A11 chips as early as the second quarter of 2017 and building the chips will likely start to generate revenues at TSMC in the third quarter. The A11-series processor will power the iPhone models slated for launch in the second half of 2017.
TSMC is expected to get two-thirds of the overall A11 chip orders from Apple.
The company is officially refusing to comment on Digitimes’ story, but it does fit into what we have already been told about Jobs’ Mob’s plans for next year.
On Monday, a SiSoft benchmarking software leak revealed some performance numbers for Intel’s upcoming Core i7 7700K CPU, based on third-generation 14nm Kaby Lake architecture.
According to the results, the Core i7 7700K is a quad-core chip running at 3.60GHz (up to 4.2GHz Turbo) and features eight threads, 8MB of L3 cache, and includes integrated graphics with 24 execution units and the same 1,150MHz clockspeed as the Core i7 6700K (Intel HD Graphics 530, GT2, 24 units).
Running at the 4.20GHz Turbo clock frequency in Windows 10 x64 (and perhaps using an engineering sample), the benchmarks show 118.71 GOPS (giga-operations per second) across eight threads, 313.84 megapixels per-second in the multimedia test, 35.30 GOPS in the Microsoft .NET arithmetic benchmark, 5.59GB/s cryptographic performance, 23.2 nanoseconds DDR4 latency, and 37.41 megapixels per-second GPU performance.
This particular chip is the successor to Intel’s Skylake-based Core i7 6700K, the company’s top quad-core option for Socket LGA 1151, which launched in Q3 2015 at a 4.0GHz base frequency (4.2GHz Turbo), eight threads, 8MB L3 cache and a 91W TDP at $349 MSRP.
Intel’s Core i7 7700K is likely to become the company’s new LGA 1151 unlocked flagship between now and Q3 of next year when it unveils its 10-nanometer Cannonlake lineup (see: Intel’s updated Moore’s Law development model). Meanwhile, most brand vendors will likely start shipping Kaby Lake CPUs between July and October 2016.
Kaby Lake desktop CPUs like the Core i7 7700K will retain full compatibility with existing Intel Z170 motherboards, but the company will also offer a newer 200-series chipset built on LGA 1151 with a few more I/O-side improvements. The chipset is said to include up to 24 PCI-Express 3.0 lanes (up from 20), six native SATA III 6Gbps ports and ten USB 3.0 ports.
Samsung Electronics is introducing a third 14-nano FinFET system semiconductor process that has lower electricity consumption and production cost than previous cost.
According to the Electronic Times, Samsung said that it will soon be completing development of Low-Power Compact (LPC) 14-nano FinFET process. Strategic partners of Samsung’s foundry business are predicting that this process will be used in anger by the end of the year.
All this is moving fast Samsung mass-produced Low Power Early (LPE) Chips, which are 1st generation chips just last year. It has just mass-produced second 2nd generation 14-nano LPP66 (Low Power Plus) chips that have 15 per cent lesser electricity consumption compared to LPE chips.
The Exynos 8 Octa Series and Qualcomm’s Snapdragon 443 820 which is under the bonnet of the Galaxy S7 are mass-produced through 14-nano LPP process.
Samsung’s third generation process reduces the number of masks that are used for wafer manufacturing process. It is expected that 14 nano will be around for as long as 28 nano was.
Even when 10-nano and 7-nano processes are developed, there will be many fabless manufacturing companies will still use cost-efficient 14-nano process.
Qualcomm, Samsung and Mediatek recently introduced new 14 and 16-nano AP products that are inexpensive. They will be used for Snapdragon 443 625, Exynos 7870, and Helio P20, and this indicates that a number of chips produced by 14-nano process will increase.
Samsung’s 14-nano LPC process, will start a war with Taiwan’s TSMC in a battle to secure customers. TSMC has three types of 16-nano FinFET processes. It’s first 16-nano FinFET process arrived at the end of 2014.
After five years, it seems that Apple is back to loving Samsung’s NAND flash memory again.
According to ETNews, Samsung will be back inside the iPhone 7 after five years. While many thought that the reason that Apple pulled Samsung out of the iPhone 6s was pettiness over the trademark battle over who invented the rounded rectangle, it turns out that Apple’s wanted electromagnetic interference (EMI) shielding requirements or special coatings on the memory packages.
Apple was looking to individually shield more parts inside its devices so it could dispense with discrete metal shielding components, which could ultimately save on logic board space and allow more room. At the time Samsung’s use of ball grid array (BGA) packaging put it at a disadvantage to competing products that use land grid array (LGA) package contacts, which allow the package to sit flush with the printed circuit board.
Samsung’s existing sputter coat EMI shielding technologies were insufficient for Apple’s performance requirements, becuase of the shielding gaps created by the raised BGA contacts. However new, cheaper spray techniques for ultra-thin coats of metal shielding has changed all that. Also Samsungs 3D V-NAND memories offering up to 256 Gb densities on the market currently.
Samsung is also set to start supplying Apple with OLED panels for future iPhones. All up it means that a big chunk of your iPhone is a Samsung. Still you get what you pay for. Anyway, with the acception of Foxconn, being an Apple supplier is a kiss of death in the long term. Maybe Apple thought it was better to score its revenge on Samsung by making it a partner.
According to the latest report, Nvidia plans to launch next-generation mainstream segment graphics cards, based on GP106 GPU, in Autumn, or late Q3/early Q4 2016.
According to a report coming from Sweclockers.com, Nvidia’s mainstream graphics cards, which will be based on a GP106 Pascal GPU, should be coming in Autumn, and be ready for sales by the time for a Christmas shopping season.
Meant to replace the currently available Maxwell-based GTX 960 and GTX 950 graphics cards, the upcoming mainstream Geforce graphics cards, most likely named as the GTX 1060 and GTX 1050, could end up with two enabled graphics processing clusters (GPCs), which means that SKUs could end with up to 1280 CUDA cores.
While the upcoming GP104-based graphics cards should cover the higher-end consumer market, the mid-range market is mostly the cash-cow for companies so having that segment on store shelves before Christmas shopping season is quite important.
Our sources are confident that AMD is about to announce a joint venture deal with China-based Sugon company.
Sugon might not be a name you’ve heard much about, but the company has now made a direct deal to manufacture server-based hardware for the Chinese Academy of Sciences.
In their own words:
“Sugon Information Industry Co., Ltd. (Sugon for short) is a national high-tech enterprise established on the basis of the major scientific research achievements of the National High Technology Research and Development Program (the 863 Program) with the vigorous promotion by the Chinese Academy of Sciences.”
The company specializes in R&D and manufacturing of high-performance computers (HPCs), enterprise servers and datacenter products, and they also do some software design and system integration as well. Between 2009 and 2014, they were on China’s TOP 100 supercomputer list consecutively by market share.
Sugon made news recently with its Nebula high-performance computer that managed to get ranked second place in the 35th Global Supercomputer TOP 500 Competition. The supercomputer they built topped a 3 petaflops per second system peak and a 1.271 petaflops times per second measured Linpack speed. These numbers easily made it the third supercomputer in the world with performance measuring over a petaflop (PF).
AMD is about to announce a joint venture with this company, and if the deal includes any cooperation with future next-generation products such as AMD’s Zen x86 high-end CPU, then the Silicon Valley company might be on the right track here. The performance of AMD’s server-based Zen products plus the potential use of Tarnhelm Zen meets AMD’s Greenland APU server product, which sounds like a great idea. Fudzilla has mentioned the existence of up to a 16-core Zen APU with Greenland HMB 2.0 GPU, DDR4 support and a super fast interconnect with coherent fabric more than a year ago.
According to an interview from Inside HPC with Dr. Qing Ji, Deputy General Manager of the HPC Division at Sugon, the overseas company plans to expand to the western market. Is this a Coincidence?
Intel has been showing off its new Apollo Lake chips, and if the outfit is correct it could shake up the lower-end PC market.
At the moment Intel’s Atoms have their work cut out for them supporting heavy lifting task like 4K video. However Apollo Lake, Intel’s a next-generation system-on-a-chip that promises to sort out a few of those problems.
It is compact and efficient enough for PC makers can afford to slim things down without as many compromises. The more inclusive design could mean that OEMs can spend more on more RAM and better displays, for example.
Apollo Lake uses Skylake’s graphics technology which enables full hardware-based 4K video playback and an overall boost to visual performance. It will also provide better support for newer technology like the USB-C.
Intel is saying nothing about clock speeds or pricing but its promising Celeron- and Pentium-branded processors in the second half of 2016.